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AMD Details EPYC Bergamo CPUs With 128 Zen 4C Cores, Available Now
AMD announced a range of new products today at its Data Center and AI Technology Premiere event in San Francisco, California. The company finally shared more details about its 5nm EPYC Bergamo processors for cloud native applications, and the chips are shipping to customers now.
AMD also announced its Instinct MI300 processors that feature 3D-stacked CPU and GPU cores on the same package with HBM, along with a new GPU-only MI300X model that is also used to bring eight accelerators onto one platform that wields an incredible 1.5TB of HBM3 memory. AMD also announced that its EPYC Genoa-X processors with up to 1.1GB of L3 cache. All three of these products are available now, but AMD also has its EPYC Sienna processors for telco and the edge coming in the second half of 2023.
All of these offerings are designed to maximize power efficiency for highly-parallel and latency-tolerant workloads. Examples include high-density VM deployments, data analytics, and front-end web services. The chips offer higher core counts than standard data center solutions, with a lower frequency and power envelope.